Diamond Wire Cut Wafers

Defects present in silicon wafers can be responsible for lower photovoltaic cell efficiency. Being able to detect such defects in a fast and non-destructive way is ideal for early pruning of bad wafers, avoiding useless and expensive further processing. The increasing use of diamond wire saws increase the challenge of detecting defects due to pronounced saw marks at the surface of the wafers. In this project, UCF researchers study the effects of defects on the polarized reflection of light at the surface of the diamond wire cut wafer and classify the various reflection patterns, aiming not only at detecting the presence of defect, but also in identifying them.

Years of Research:

Sponsored by: U.S. Department of Energy